Electrodeposited copper-tin alloys were prepared using a tripolyphosphate electrolyte. MBssbauer spectra revealed that a Sn(IV) compound and &II&I were components of the alloys obtained in the deposition range. -250 to -550mV (us nhe). At -770 mV (us nhe) a Sn(IV) species j-Cu-Sn alloy, q-Cu,Sn, and
Mössbauer and x-ray fluorescence studies of Tin—Nickel electrodeposited alloys
✍ Scribed by J.A. Jaén; M.L. Varsányi; H. Csontos; A. Vértes
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 241 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0013-4686
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✦ Synopsis
Tu-mckel electrodeposlted alloys were stuched by the help of Mossbauer spectroscopy and energy dlsperslve X-ray fluorescence The tm phase composltlon consisted of N@n, mtermetalhc compound, elemental tm and t+,Sn, formed at the Interface of the copper substrate Increments of the quantity of mckel m the electrodeposIted alloys are observed when the platmg bath temperature IS Increased
📜 SIMILAR VOLUMES
We have found significant differences between the low temperature Miissbauer spectra of rapidly quenched and electrochemically prepared samples in the investigated cases even if the room temperature spectra were similar. In the spectra of electrodeposited alloys a new component appears at low temper