Structural integrity and thermal stability of TiN/CoSi2 used as local interconnect in a self-aligned CoSi2 process

✍ Scribed by Rama I. Hegde; Robert E. Jones Jr.; Vidya S. Kaushik; Philip J. Tobin

• Publisher: Elsevier Science
• Year: 1991
• Tongue: English
• Weight: 878 KB
• Volume: 52
• Category: Article
• ISSN: 0169-4332
• DOI: 10.1016/0169-4332(91)90115-z