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Stresses in a Multilayer Thin Film/Substrate System Subjected to Nonuniform Temperature

โœ Scribed by Feng, X.; Huang, Y.; Rosakis, A. J.

Book ID
120724840
Publisher
The American Society of Mechanical Engineers
Year
2008
Tongue
English
Weight
206 KB
Volume
75
Category
Article
ISSN
1884-832X

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๐Ÿ“œ SIMILAR VOLUMES

Multilayer thin films/substrate system w
Multilayer thin films/substrate system with variable film thickness subjected to non-uniform misfit strains
โœ D. Ngo; X. Feng; Y. Huang; A.J. Rosakis ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 279 KB

Current methodologies used to infer thin-film stress from curvature measurements are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. These methodologies have recently been extended to a single thin film of non-uniform thick