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Stresses and strains in a plate bonded to a substrate: Semiconductor devices

✍ Scribed by R. Zeyfang

Book ID: 107855970
Publisher: Elsevier Science
Year: 1971
Tongue: English
Weight: 345 KB
Volume: 14
Category: Article
ISSN: 0038-1101
DOI: 10.1016/0038-1101(71)90172-9

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