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Stress-driven migration of simple low-angle mixed grain boundaries

✍ Scribed by A.T. Lim; M. Haataja; W. Cai; D.J. Srolovitz


Book ID
113415917
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
559 KB
Volume
60
Category
Article
ISSN
1359-6454

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✍ A.T. Lim; D.J. Srolovitz; M. Haataja πŸ“‚ Article πŸ“… 2009 πŸ› Elsevier Science 🌐 English βš– 440 KB

We investigated the migration of a symmetric tilt, low-angle grain boundary (LAGB) under applied shear stress in the presence of extrinsic dislocations. The results demonstrate that there is a threshold stress for the LAGB to depin from extrinsic dislocations. Below the threshold stress, the LAGB re

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Theoretical models are suggested that describe the effects of stress-driven migration of grain boundaries (GBs) on both the formation of nanoscale cracks (nanocracks) and the growth of comparatively large cracks in deformed nanocrystalline ceramics and metals. The GB migration under consideration is

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Stress-induced migration of planar grain boundaries in aluminum bicrystals was measured for both low-and high-angle symmetrical h1 0 0i tilt grain boundaries across the entire misorientation range (0-90Β°). Boundary migration under a shear stress was observed to be coupled to a lateral translation of