Stepped current electromigration test of multilevel aluminum metallizations on wafer level

✍ Scribed by M. Strasser; M. Schneegans; H. Hammer; R. Frahm

• Book ID: 105897785
• Publisher: Springer
• Year: 1999
• Tongue: English
• Weight: 273 KB
• Volume: 365
• Category: Article
• ISSN: 1618-2650
• DOI: 10.1007/s002160051452