✦ LIBER ✦
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT)
✍ Scribed by Cher Ming Tan; Kelvin Ngan Chong Yeo
- Book ID
- 110297330
- Publisher
- Springer US
- Year
- 2001
- Tongue
- English
- Weight
- 116 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0923-8174
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