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Steady-state creep characteristics of Ni-22 at % Cu alloy at high and intermediate temperature

โœ Scribed by Soo Woo Nam; Soon Ig Hong; Donc Hyuk Shin


Publisher
Springer
Year
1983
Tongue
English
Weight
574 KB
Volume
18
Category
Article
ISSN
0022-2461

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The creep characteristics of Ni-Cu alloys at intermediate temperatures (T 7) and the activation energy for creep (which is less than the activation energy for lattice diffusion), suggest that the creep mechanism is dislocation climb controlled by pipe diffusion. The present analysis shows that the c