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Anomalous creep behaviour of a Ni-22 at % Cu alloy and the miscibility gap

✍ Scribed by Sun Ig Hong; In Sik Choi; Soo Woo Nam


Publisher
Springer
Year
1984
Tongue
English
Weight
911 KB
Volume
19
Category
Article
ISSN
0022-2461

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The creep characteristics of Ni-Cu alloys at intermediate temperatures (T 7) and the activation energy for creep (which is less than the activation energy for lattice diffusion), suggest that the creep mechanism is dislocation climb controlled by pipe diffusion. The present analysis shows that the c