Statistical metrology for characterizing CMP processes

✍ Scribed by Sharad Prasad; W. Loh; A. Kapoor; E. Chang; B. Stine; D. Boning; J. Chung

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 385 KB
• Volume: 33
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(96)00052-4

✦ Synopsis

CMP processes are used to planarize layers; however, variations in ILD thickness due to various layout factors can affect the modelling of interconnect parameters. In this paper an overview of 'Statistical Metrology' for CMP processes is presented. Using statistical metrology for CMP the process or interconnect design rules can be optimized for minimal variations.