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Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

โœ Scribed by Wei, Xiaojin; Joshi, Yogendra


Book ID
120992269
Publisher
The American Society of Mechanical Engineers
Year
2004
Tongue
English
Weight
296 KB
Volume
126
Category
Article
ISSN
1043-7398

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