Single-phase liquid cooled microchannel heat sink for electronic packages

✍ Scribed by H.Y. Zhang; D. Pinjala; T.N. Wong; K.C. Toh; Y.K. Joshi

• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 410 KB
• Volume: 25
• Category: Article
• ISSN: 1359-4311
• DOI: 10.1016/j.applthermaleng.2004.09.014