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Stability analysis of the adhesive strength between substrate and a thin film

✍ Scribed by Th. Richter; H. Gläser

Book ID
117627136
Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
376 KB
Volume
9
Category
Article
ISSN
0927-0256

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Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox