Determination of adhesion strength between a carbon film and a polymeric substrate
β Scribed by Voronkin, M.A.; Dub, S.N.; Lupich, I.N.; Maslyuk, B.A.
- Book ID
- 123033991
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 674 KB
- Volume
- 3
- Category
- Article
- ISSN
- 0925-9635
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox
Polyethylene (PE) is a semi-crystalline polyolefin widely used in consumer products and for molding materials due to its excellent thermal properties. Among its remarkable physical and chemical properties, however, one characteristic that may have limited the expansive usage of PE is its poor adhesi