In this paper, we present the unique features exhibited by a novel double gate MOSFET in which the front gate consists of two side gates as an extension of the source/drain. The asymmetrical side gates are used to induce extremely shallow source/drain regions on either side of the main gate. Using t
Source/drain optimization of underlapped lightly doped nanoscale double-gate MOSFETs
β Scribed by D.H. Tassis; A. Tsormpatzoglou; C.A. Dimitriadis; G. Ghibaudo; G. Pananakakis; N. Collaert
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 650 KB
- Volume
- 87
- Category
- Article
- ISSN
- 0167-9317
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β¦ Synopsis
The impact of the spacer length at the source (L s ) and drain (L d ) on the performance of symmetrical lightly-doped double-gate (DG) MOSFET with gate length L = 20 nm is analyzed, with the type and doping concentration of the spacers kept the same as in the channel material. Using the transport parameters extracted from experimental data of a double-gate FinFET, simulations were performed for optimization of the underlapped gate-source/drain structure. The simulation results show that the subthreshold leakage current is significantly suppressed without sacrificing the on-state current for devices designed with asymmetrical source/drain extension regions, satisfying the relations L s = L/2 and L d = L. In independent drive configuration, the top-gate response can be altered by application of a control voltage on the bottom-gate. In devices with asymmetrical source/drain extension regions, simulations demonstrate that the threshold voltage controllability is improved when the drain extension region length is increased.
π SIMILAR VOLUMES
A two-dimensional numerical solution of electrostatic potential and electric field profiles are presented for lightly doped nano-scale Double-Gate Metal-Oxide-Semiconductor-Field-Effect-Transistor (DG-MOSFET). We have developed quasi-static (QS) model for evaluating bulk and inversion charges based