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Some properties of vacuum-deposited films of aluminum, nickel, cobalt, copper, and Cu-Cr-Al alloy

✍ Scribed by M. V. Belous; G. I. Pavlenko; V. I. Popov


Book ID
112417250
Publisher
Springer
Year
1971
Tongue
English
Weight
612 KB
Volume
14
Category
Article
ISSN
1573-9228

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In this work, the improvement of MOCVD Cu properties by alloy formation was investigated. Sequential deposited Al / Cu bilayer and Al / Cu /Al trilayer were annealed at 230-4508C in vacuum and H . Additionally, 2 the trilayer was annealed in N . Vacuum annealing of both bilayer and trilayer stacks r