Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application

✍ Scribed by Dae-Gon Kim; Jong-Woong Kim; Jung-Goo Lee; Hirotaro Mori; David J. Quesnel; Seung-Boo Jung

• Book ID: 116598667
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 666 KB
• Volume: 395
• Category: Article
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2004.11.038