Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

✍ Scribed by L. N. Ramanathan; J. W. Jang; J. K. Lin; D. R. Frear

• Book ID: 107453510
• Publisher: Springer US
• Year: 2005
• Tongue: English
• Weight: 359 KB
• Volume: 34
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-005-0262-7