Solder with discontinuous melting point in semiconductor laser arrays and stacks

✍ Scribed by Dong-ming Cheng; Li-jun Wang; Yun Liu; Yu-lian Cao; Li-na Li; Fu-bin Gao

• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 85 KB
• Volume: 35
• Category: Article
• ISSN: 0030-3992
• DOI: 10.1016/s0030-3992(02)00123-8

✦ Synopsis

High power semiconductor laser arrays must be mounted in the epitaxy-side down conÿguration for good heat transfer and so require a well-controlled solder. Selection of solder is very important in semiconductor laser arrays and stacks. Usually, the solder consists of two layers. The outer layer prevents In from oxidation. A new type of solder with several layers of Au between the two layers of In was made, which constitutes of multi-layer of W/Ni/Au/In/Cu. In packaging, the Au layer in the solder does not melt. Quick temperature decrease can avoid expansion of the solder. The solder cannot oxidize during packaging.