Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

✍ Scribed by J. W. Jang; P. G. Kim; K. N. Tu; D. R. Frear; P. Thompson

• Book ID: 125843819
• Publisher: American Institute of Physics
• Year: 1999
• Tongue: English
• Weight: 772 KB
• Volume: 85
• Category: Article
• ISSN: 0021-8979
• DOI: 10.1063/1.370627