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Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

✍ Scribed by Lau, J.H.; Chang, C.; Lee, S.-W.R.

Book ID: 125514039
Publisher: IEEE
Year: 2001
Tongue: English
Weight: 551 KB
Volume: 24
Category: Article
ISSN: 1521-3331
DOI: 10.1109/6144.926395

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