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Solder for high-temperature joints


Publisher
Elsevier Science
Year
1999
Tongue
English
Weight
143 KB
Volume
2
Category
Article
ISSN
1464-2859

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In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring-shaped LEDs with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their char