✦ LIBER ✦

Solder electromigration in Cu/In/Cu flip chip joint system

✍ Scribed by Kimihiro Yamanaka; Yutaka Tsukada; Katsuaki Suganuma

No coin nor oath required. For personal study only.

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Electromigration-induced failure in flip

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✍ T. L. Shao; K. C. Lin; Chih Chen 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 714 KB