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SMA controlled slurry dispense system for CMP processing


Book ID
114405426
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
162 KB
Volume
2001
Category
Article
ISSN
1471-3918

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As integrated circuit devices shrink to smaller dimensions, a chemical mechanical polishing (CMP) process was required for the global planarization of the inter-metal dielectric (IMD) layer with free-defects. However, as the IMD layer gets thinner, micro-scratches are becoming a major defect. Micro-