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SiO2 prepared by remote plasma-enhanced chemical vapor deposition using SiCl4 and O2 at substrate temperatures of less than 200 °C

✍ Scribed by A. Ortiz; C. Falcony; M. Farias; L. Cota-Araiza; G. Soto


Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
526 KB
Volume
206
Category
Article
ISSN
0040-6090

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