Single- and multi-layer surface-micromachined platforms using electroplated sacrificial layers

✍ Scribed by Young W. Kim; Mark G. Allen

• Publisher: Elsevier Science
• Year: 1992
• Tongue: English
• Weight: 638 KB
• Volume: 35
• Category: Article
• ISSN: 0924-4247
• DOI: 10.1016/0924-4247(92)87008-5

✦ Synopsis

The use of electroplated sacrificial layers in the fabrication of surface-micromachined structures is discussed Electroplated sacrificial layers offer two benefits first, structures suspended several tens of microns above a substrate can be fabricated due to the ability to deposit relatively thick electroplated layers, secondly, the selective deposition of electroplated material only on conductors allows multi-layer three-dimensional structures to be fabricated in a self-aligned process Single-layer surface-micromachined bodges and platforms suspended 10 to 50 pm above the surface have been fabricated in this manner In addition, dual-layer platforms with some portions suspended 2 to 3 µm above the surface and other portions 10 to 50 fm above the surface have also been fabricated Both structures are demonstrated using copper as the sacrificial layer and polyimide as the structural matenal, although other material combmations can also be used Electrostatic actuation of both types of platforms has been achieved