Spectral analysis of surface waves in single and multi-layer slabs with finite thickness using finite element modelling

Finite element modeling and simulation f

Finite element modeling and simulation for bending analysis of multi-layer printed circuit boards using woven fiber composite

✍ L. Li; S.M. Kim; S.H. Song; T.W. Ku; W.J. Song; J. Kim; M.K. Chong; J.W. Park; B 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 424 KB

As the electronic products are desired to have many functions with low weight and small size increasingly, the ultra-thin and multi-layer printed circuit boards (PCBs) are required to be used extensively in electronic packaging assemblies. Usually, these multi-layer PCBs consist of multiple layers o