𝔖 Bobbio Scriptorium

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Simulation of transients in VLSI packaging interconnections : Olgierd A. Palusinski, J. C. Liao, John L. Prince and Andreas C. Cangellaris. IEEE Trans. Compon. Hybrids mfg Technol. 13(1), 160 (1990)

Publisher: Elsevier Science
Year: 1991
Tongue: English
Weight: 120 KB
Volume: 31
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(91)90453-e

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