Electrical modeling of interconnections in multilayer packaging structures : Algierd A. Palusinski, J. C. Liao, Paul E. Teschan, John L. Prince and Francisco Quintero. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 217 (1987)

• Publisher: Elsevier Science
• Year: 1988
• Tongue: English
• Weight: 127 KB
• Volume: 28
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(88)90094-7