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Simulation of transients in VLSI packaging interconnections

โœ Scribed by Palusinski, O.A.; Liao, J.C.; Prince, J.L.; Cangellaris, A.C.


Book ID
117872697
Publisher
IEEE
Year
1990
Tongue
English
Weight
565 KB
Volume
13
Category
Article
ISSN
0148-6411

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