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Simulation of the Postexposure Bake Process of Chemically Amplified Resists by Reaction–Diffusion Equations

✍ Scribed by Tsung-Lung Li

Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
149 KB
Volume
173
Category
Article
ISSN
0021-9991

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✦ Synopsis

In this work, a time-dependent postexposure bake (PEB) simulator is presented by solving a set of reaction-diffusion equations modeling the deprotection reaction of polymers and the diffusion of acids in chemically amplified resists. The simulator is time-dependent in the sense that model parameters including both reaction parameters and diffusion coefficients are treated as time-dependent functions in the entire course of the PEB process. The alternating direction implicit method is utilized to iteratively solve the set of reaction-diffusion equations. An error-control scheme is devised for automatic time-stepping. This PEB simulator is, hence, capable of simulating the effects of the temperature-time history of a wafer. It is then applied to simulate the resist profiles of line/space patterns and contact holes.

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