Signal Integrity Characterization Techniques

✍ Scribed by Mike Resso, Eric Bogatin

• Publisher: IEC
• Year: 2009
• Tongue: English
• Leaves: 783
• Edition: 2
• Category: Library

✦ Synopsis

Today’s emerging high-speed digital applications require a special kind
of design engineer who understands the subtle signal integrity issues at
hand. Although a classical electrical and computer engineering education
is helpful, it is the high-frequency microwave effects that normally cause
the most problems within telecommunications and computer systems,
channels, and components. Reflections from impedance discontinuities,
crosstalk, intra-line skew, and a multitude of other problems can
immediately stop a system from working properly.
Clearly, there is a gap in the college electrical engineering courses
between the traditional digital and microwave curricula. This is why
learning never stops for signal integrity engineers. This book addresses
this gap with a focus on a practical and intuitive understanding of signal
integrity effects within the data transmission channel. High-speed
interconnects such as connectors, printed circuit boards (PCBs), cables,
integrated circuit (IC) packages, and backplanes are critical elements of
differential channels that must be designed using today’s most powerful
analysis and characterization tools. Both measurements and simulation
must be done on the device under test, and both activities must yield data
that correlates with each other. Most of this book focuses on real-world
applications of signal integrity measurements.

✦ Table of Contents

Part I: Getting Started: Introducing TDR and VNA Techniques and the Power of S-Parameters
Part II: Backplane Measurements and Analysis
Part III: Assuring Quality Measurements: Probing and De-Embedding
Part IV: Jitter and Active Signal Analysis
Part V: Analysis of New Technologies
Part VI: Future Technology Trends