Si layer transfer to InP substrate using low-temperature wafer bonding

✍ Scribed by J. Arokiaraj; S. Tripathy; S. Vicknesh; S.J. Chua

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 432 KB
• Volume: 253
• Category: Article
• ISSN: 0169-4332
• DOI: 10.1016/j.apsusc.2006.01.071