Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration

✍ Scribed by Tetsuzo Yoshimura

• Publisher: Jenny Stanford Publishing
• Year: 2021
• Tongue: English
• Leaves: 381
• Edition: 1
• Category: Library

✦ Synopsis

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

✦ Table of Contents

Cover
Half Title
Title Page
Copyright Page
Dedication
Table of Contents
Preface
Chapter 1: Introduction
Chapter 2: Guidelines toward Self-Organized 3D Integrated Optical Interconnects
2.1: Advantages of Lightwave Implementation into Boxes of Computers
2.2: Integrated Optical Interconnects
2.3: Self-Organization of 3D Integrated Optical
Interconnects
2.4: E-O and O-E Signal Conversion in Integrated Optical
Interconnects
2.5: Core Technologies for Self-Organized 3D Integrated
Optical Interconnects
Chapter 3: Scalable Film Optical Link Modules
3.1: Concept of S-FOLM
3.2: 3D Integrated Optical Interconnects Built by S-FOLMs
3.2.1: 3D OE Platforms
3.2.2: Structures within Boxes of Computers
3.3: Various OE Structures Built by S-FOLMs
3.3.1: OE-Film/Electrical Substrate Stack
3.3.2: OE-Film/OE-Film Stack and Backside
Connection
3.3.3: Both-Side Mounting
3.3.4: Micro Optical Link Module
3.3.5: OE Tap Guide
3.3.6: WDM Transceiver and WDM Inter-PCB Connect
3.3.7: 3D Optical Circuits for WDM
3.4: Optoelectronic Amplifier/Driver-Less Substrate
3.4.1: Concept of OE-ADLES
3.4.2: Power Dissipation and RC Delay in OE-ADLES
Chapter 4: Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits
4.1: Built-In Mask Method
4.2: Fabrication of Optical Waveguides and Vertical Mirrors
4.2.1: Waveguide Cores
4.2.2: Vertical Mirrors
4.3: Vertical Mirrors with Multi-Core-Layer Skirt-Type Structures
4.3.1: Observation of Beam Leakage and Scattering at Vertical Mirrors
4.3.2: Three-Core-Layer Skirt-Type Vertical Mirrors
4.3.3: Simulations of Beam Leakage/Scattering at Vertical Mirrors
4.3.4: Fabrication of Multi-Core-Layer Skirt-Type Vertical Mirrors
4.4: 3D Optical Circuits
4.4.1: Structures
4.4.2: Type I: Stacked Waveguide Films with Vertical Mirrors
4.4.2.1: Demonstration of 3D optical wiring
4.4.2.2: Loss measurements
4.4.2.3: Loss at Optical Z-Connection
4.4.3: Type II: Waveguide Films with Vertical Waveguides
4.5: Optical Waveguide Films Stacked on Electrical Boards
4.5.1: Process Flow
4.5.2: Waveguide-Film Stacking on PCBs
4.6: Nanoscale Waveguides Made of PRI Sol–Gel Thin Films
4.6.1: Linear, Bending, and Branching Waveguides
4.6.1.1: Fabrication processes
4.6.1.2: Linear waveguides
4.6.1.3: Bending and branching waveguides
4.6.2: Vertical Mirrors and All-Air-Cladding Waveguides
Chapter 5: Resource-Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT
5.1: Advantages of PL-Pack with SORT over Conventional Packaging
5.2: PL-Pack with SORT
5.2.1: Whole Process Flow of PL-Pack with SORT
5.2.2: Process Flow of SORT
5.3: Impacts of PL-Pack with SORT
5.3.1: Material Consumption and Costs
5.3.2: Mechanical Properties
5.3.3: Transfer Step Count
5.3.4: Small/Thin-Die Placement Density
5.4: SORT of Polymer Waveguide Lenses
5.5: SORT of Waveguide Cores
5.5.1: SORT Process for Optical Waveguides
5.5.2: Experimental Demonstration of SORT for Optical Waveguides
5.6: Light-Assisted SORT
5.6.1: LA-SORT
5.6.2: Experimental Demonstration of LA-SORT
5.7: SORT for Nanoscale Heterogeneous Integration
Chapter 6: High-Speed/Small-Size Light Modulators and Optical Switches
6.1: Classification of Light Modulators and Optical Switches
6.2: Variable Well Optical ICs and Waveguide Prism Deflectors
6.3: Design and Predicted Performance of WPDs
6.3.1: EO Materials for WPDs
6.3.2: Model for 2 × 2 WPD Optical Switch
6.3.2.1: Preliminary model
6.3.2.2: Optimized model for performance evaluation
6.3.3: Predicted Performance
6.4: Advanced WPDs
6.4.1: WPD Optical Switches with ADD Functions
6.4.2: WPD Optical Switches with MUX/DEMUX Functions
6.5: Transient Responses in Microring Resonators and Photonic Crystals
Chapter 7: Self-Organized Lightwave Networks
7.1: Concept of SOLNETs
7.1.1: Types of SOLNETs
7.1.2: PRI Materials
7.1.3: One-Photon and Two-Photon SOLNETs
7.1.4: Fabrication Processes of Luminescent Targets and Luminescent Regions
7.2: Performance of SOLNETs Predicted by Computer Simulations
7.2.1: Simulation Models
7.2.2: Simulation Procedures
7.2.3: SOLNETs between Nanoscale Waveguides
7.2.3.1: TB-SOLNET/P-SOLNET
7.2.3.2: R-SOLNET
7.2.3.3: LA-SOLNET
7.2.3.4: Performance of couplings
7.2.4: SOLNETs between Microscale and Nanoscale Waveguides
7.2.4.1: TB-SOLNET/P-SOLNET
7.2.4.2: R-SOLNET
7.2.4.3: LA-SOLNET
7.2.4.4: Performance of couplings
7.3: Experimental Demonstrations of One-Photon SOLNETs
7.3.1: One-Photon TB-SOLNETs
7.3.2: One-Photon R-SOLNETs with Micromirrors Formed by Free-Space Write Beams
7.3.3: One-Photon R-SOLNETs with Micromirrors
7.3.4: One-Photon R-SOLNETs with Reflective Objects
7.3.5: One-Photon R-SOLNETs with Luminescent Targets
7.3.5.1: Coumarin 481 luminescent targets
7.3.5.2: Alq3 luminescent targets
7.4: Experimental Demonstrations of Two-Photon SOLNETs
7.4.1: Two-Photon TB-SOLNETs
7.4.2: Two-Photon R-SOLNETs
Chapter 8: Self-Organized 3D Integrated Optical Interconnects: Model Proposals
8.1: 3D Integrated Optical Interconnects with P- and R-SOLNETs
8.2: 3D Integrated Optical Interconnects with LA- and R-SOLNETs
Chapter 9: Self-Organized 3D Micro Optical Switching Systems: Model Proposals and Predicted Performance
9.1: Advantages of 3D-MOSS
9.2: Architecture of 3D-MOSS
9.2.1: 3D-MOSS
9.2.2: 3D-MOSS with SOLNET Implementation
9.3: Predicted Performance of 1024 × 1024 3D-MOSS
9.3.1: Structural Model
9.3.2: Insertion Loss
9.3.3: Electrical Characteristics
9.3.4: Impact of HIC Waveguide Implementation into 3D-MOSS
Chapter 10: Film-Based Integrated Solar Energy Conversion Systems
10.1: Integrated Solar Films
10.2: Waveguide-Type Thin-Film Solar Cells
10.3: Key Fabrication Processes for Integrated Solar Films
10.4: Multilayer Waveguide-Type Light Beam Collecting Films
10.4.1: Simulation Procedure
10.4.2: Light Beam Collection by Light Beam Collecting Films
10.4.3: Overall Consideration for Light Beam Collecting Efficiency
10.5: Thin-Film Artificial Photosynthesis Cells
Chapter 11: Embodiments Disclosed in Patents
11.1: Integrated OE MCMs
11.2: 3D Optical Interconnects
11.2.1: Horizontal Layer Attachment
11.2.2: Vertical Layer Attachment
11.3: Micro Optical Link Modules
11.4: Active Optical Sheets, Boards, and Connectors
Chapter 12: Future Challenges
12.1: Enhancement of the Pockels Effect by Controlling Wavefunction Shapes
12.2: Molecular Layer Deposition (MLD)
12.3: Growth of Polymer MQDs by MLD
Epilogue
Index