A self-assembly nanopatterning method for epitaxial-CoSi layers has been developed and investigated. It is 2 based on anisotropic diffusion of Co / Si atoms in a stress field during rapid thermal oxidation. The stress field is generated by a patterned trench mask consisting of 20 nm SiO and 300 nm S
Self-assembly patterning of epitaxial CoSi2 wires
β Scribed by P Kluth; Q.T Zhao; S Winnerl; S Mantl
- Book ID
- 104305610
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 895 KB
- Volume
- 60
- Category
- Article
- ISSN
- 0167-9317
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β¦ Synopsis
We have investigated a self-assembly process for patterning epitaxial CoSi nanowires using local oxidation 2 of silicides (LOCOSI). This involves single-crystalline, epitaxial CoSi grown on Si(100) by molecular beam 2 allotaxy (MBA). A mask consisting of 20 nm SiO and 400 nm Si N , deposited by plasma enhanced chemical 2 34
vapor deposition (PECVD) and patterned with conventional optical lithography, induces a stress field near its edges into the underlying CoSi / Si heterostructure. A rapid thermal oxidation step leads to the separation of the 2 CoSi layer in this region due to the concomitant anisotropic diffusion of the cobalt atoms in the stress field.
2
Etching back the oxide underneath the nitride shifts the stress field underneath the mask leading to the formation of homogeneous silicide wires along the mask during a second oxidation step. Using this new approach, continuous wires with a minimum width of approximately 80 nm were observed.
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