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Self-assembly of three-dimensional Au inductors on silicon

✍ Scribed by Kiziroglou, M.E.; Mukherjee, A.G.; Vatti, S.; Holmes, A.S.; Papavassiliou, C.; Yeatman, E.M.


Book ID
114444107
Publisher
The Institution of Engineering and Technology
Year
2010
Tongue
English
Weight
401 KB
Volume
4
Category
Article
ISSN
1751-8725

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## Abstract This letter presents the results of a new 3‐D high‐performance coil inductor, which was fabricated using standard 0.25 ΞΌm CMOS technology. Comparative evaluation with the conventional spiral inductor was performed in terms of quality factor (__Q__), inductance (__L__), and chip area. ©