Gold Nanoparticle/Polyphenylene Dendrime
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T. Vossmeyer; B. Guse; I. Besnard; R.E. Bauer; K. Müllen; A. Yasuda
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Article
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2002
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John Wiley and Sons
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English
⚖ 197 KB
ing á100ñ silicon layer on the SOI wafer was etched for 1 min (1 min is long enough to etch vertically through 340 nm of Si, without much undercutting) in a commercial silicon etchant (silicon, preferential á100ñ etchant, PSE-300, Transene CO Inc, www.transene.com). Structure Release and Folding: T