Gold Nanoparticle/Polyphenylene Dendrimer Composite Films: Preparation and Vapor-Sensing Properties

✍ Scribed by T. Vossmeyer; B. Guse; I. Besnard; R.E. Bauer; K. Müllen; A. Yasuda

• Publisher: John Wiley and Sons
• Year: 2002
• Tongue: English
• Weight: 197 KB
• Volume: 14
• Category: Article
• ISSN: 0935-9648
• DOI: 10.1002/1521-4095(20020205)14:3<238::aid-adma238>3.0.co;2-#

✦ Synopsis

ing á100ñ silicon layer on the SOI wafer was etched for 1 min (1 min is long enough to etch vertically through 340 nm of Si, without much undercutting) in a commercial silicon etchant (silicon, preferential á100ñ etchant, PSE-300, Transene CO Inc, www.transene.com).

Structure Release and Folding: The structures were released by dissolving the sacrificial layer in commercial SiO 2 etchant (fluoride±bifluoride improved buffer HF, Transene CO Inc, www.transene.com). After rinsing in the SiO 2 etchant and acetone, we transferred the 2D structures to an acidified aqueous solution (HCl, ~pH 1, a drop of surfactant (Triton X-100, Aldrich, http://www.aldrich.com) was added to minimize the formation of bubbles) and heated above the melting point of the solder. Auto-folding occurred above the m.p. of the solder on the time scale of a second. The folded structures were picked up with a magnetic tape and imaged with an SEM.