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Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

✍ Scribed by Hui Chen; Cheng-chang Jia; Shang-jie Li; Xian Jia; Xia Yang


Book ID
113107886
Publisher
Springer-Verlag
Year
2012
Tongue
English
Weight
734 KB
Volume
19
Category
Article
ISSN
1674-4799

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