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Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration

✍ Scribed by Hui Chen, Cheng-chang Jia, Shang-jie Li

Book ID: 118829912
Publisher: Springer-Verlag
Year: 2013
Tongue: English
Weight: 776 KB
Volume: 20
Category: Article
ISSN: 1674-4799
DOI: 10.1007/s12613-013-0711-x

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