Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging

✍ Scribed by Azrul Azlan Hamzah; Yusnira Husaini; Burhanuddin Yeop Majlis; Ibrahim Ahmad

• Book ID: 106185355
• Publisher: Springer-Verlag
• Year: 2007
• Tongue: English
• Weight: 338 KB
• Volume: 14
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-007-0461-7