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Silicone encapsulation of the piezoresistive composite element as a low-cost packaging for measuring high-pressure

✍ Scribed by Patrick Heinickel; Daniel Foik; Roland Werthschützky

Book ID
119355594
Publisher
Elsevier
Year
2011
Tongue
English
Weight
524 KB
Volume
25
Category
Article
ISSN
1877-7058

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