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Selection of a thermal bonding agent for temperatures below 1 K

✍ Scribed by A.C. Anderson; R.E. Peterson

Publisher
Elsevier Science
Year
1970
Tongue
English
Weight
293 KB
Volume
10
Category
Article
ISSN
0011-2275

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✦ Synopsis

The thermal contact resistances provided by a variety of materials at temperatures below G5 K are similar in magnitude, thus permitting the choice of contact agent to be based on the mechanical properties desired. The contact resistance is shown to be comprised of the bulk thermal resistance of the contact agent, plus the Kapitza resistances of the interfaces.

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