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Segregation of organic impurities in thin electroplated Cu metallizations

✍ Scribed by Stangl, Marcel ;Acker, Jörg ;Hoffmann, Volker ;Gruner, Wolfgang ;Wetzig, Klaus

Publisher: Springer-Verlag
Year: 2006
Weight: 186 KB
Volume: 156
Category: Article
ISSN: 0344-838X
DOI: 10.1007/s00604-006-0606-x

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