Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow

✍ Scribed by D. Ma; W. D. Wang; S. K. Lahiri

• Book ID: 124076548
• Publisher: American Institute of Physics
• Year: 2002
• Tongue: English
• Weight: 656 KB
• Volume: 91
• Category: Article
• ISSN: 0021-8979
• DOI: 10.1063/1.1445283