✦ LIBER ✦

Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow

✍ Scribed by Ahmed Sharif; Y.C Chan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Interfacial reaction of Pb-Sn solder and

✍ M. O. Alam; Y. C. Chan; K. C. Hung 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 740 KB

Comparative study of interfacial reactio

✍ Ahmed Sharif; Y. C. Chan 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 849 KB

Kinetics of intermetallic formation at S

✍ Jong-Hyun Lee; Yong-Seog Kim 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 403 KB

Interfacial reactions of BGA Sn–3.5%Ag–0

✍ Ahmed Sharif; M.N. Islam; Y.C. Chan 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 556 KB

Effect of substrate metallization on mec

✍ Ja-Myeong Koo; Seung-Boo Jung 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 768 KB

Mechanical and Electrical Properties of

✍ Ja-Myeong Koo; Bui Quoc Vu; Yu-Na Kim; Jong-Bum Lee; Jong-Woong Kim; Dae-Up Kim; 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 378 KB