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Scalable distributed-capacitance model for silicon on-chip spiral inductors

✍ Scribed by Fengyi Huang; Jingxue Lu; Nan Jiang


Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
184 KB
Volume
48
Category
Article
ISSN
0895-2477

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✦ Synopsis


Abstract

We present physics‐based modeling for silicon on‐chip spiral inductors, taking into account the coupling capacitance between metal spirals. The coupling capacitance C~p~ is calculated using a distributed‐capacitance model based on finite‐element analysis. As demonstrated for a series of inductors with the number of turns ranging from 2.5 to 6.5 fabricated in a 0.18‐μm CMOS technology, the current model provides simulation results for the quality factor Q, the S‐parameter, and the self‐resonance frequency f~SR~ that are in good agreement with the measurements without any fitting parameters. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 1423–1427, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21642


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A statistical description of the global performance of on-chip spiral inductors, based on extensive measurement is presented. These inductors were fabricated with different turn numbers or track lengths/track widths, but with the same spacing. From the S parameters measured using a de-embedding tech