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Sacrificial Adhesion Promotion Layers for Copper Metallization of Device Structures

✍ Scribed by Zong, Yinfeng; Shan, Xiaoying; Watkins, James J.

Book ID: 126264895
Publisher: American Chemical Society
Year: 2004
Tongue: English
Weight: 270 KB
Volume: 20
Category: Article
ISSN: 0743-7463
DOI: 10.1021/la048731q

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