𝔖 Bobbio Scriptorium
✦   LIBER   ✦

S-parameter analysis of multiconductor, integrated circuit interconnect systems

✍ Scribed by Cooke, B.J.; Prince, J.L.; Cangellaris, A.C.

Book ID
119777568
Publisher
IEEE
Year
1992
Tongue
English
Weight
775 KB
Volume
11
Category
Article
ISSN
0278-0070

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## Abstract A modified model for RF interconnect bends on lossy substrate in CMOS technology is presented. The model parameters are extracted directly from the on‐wafer S‐parameter measurements. The accuracy is verified up to 20 GHz by the measurements of the test structures. Β© 2005 Wiley Periodica