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Risk Characterization for Nanotechnology

✍ Scribed by Richard A. Williams; Kristen M. Kulinowski; Ronald White; Garrick Louis

Book ID
109158190
Publisher
Springer
Year
2010
Tongue
English
Weight
135 KB
Volume
30
Category
Article
ISSN
1573-9147

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## Abstract A multipath interconnect carries a signal on an electrical circuit by using the concept of parallel processing, that is, by providing two or more paths between the driver and the load. These paths are stacked vertically and isolated from one another by insulating layers between them. In